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This position shall be located in Shanghai.
Summary
SI/PI analysis, EMI simulation and design,
AiP design (high frequency)
HBM and Chiplet design (high speed)

Key Qualifications:
1、PhD degree in EE 3 years’ experience is preferred;
2、Prior experience in RF and Antenna design preferred
3、Solid RF fundamentals and expertise in modeling DOE’s to fine tune performance of wireless systems or the SiP module.
4、Good understanding of test / characterization parameters and test instruments such as network analyzer, spectrum analyzer, signal generators, and oscilloscope.
5、Familiar with semiconductor packaging technologies a plus.
Technical leadership is prefer.

Preferred Skills:
1、Strong communication skills, Proficient English language capability, experience work with global team members of different cultural backgrounds.

主要職責(zé)
1、Leading electrical simulation work (SI/PI) by technical expertise and bring solutions to new and advanced products
2、Participating the development, design, and characterization of advanced packaging, such as Chiplet, HBM and advanced SiP products.
3、Understanding simulation of SiP module
4、Development of AiP products: Antenna design and simulation
5、Participating customer product discussion and spec lock
6、Generating IP’s for the company.